EP2SGX60CF780C3N vs EP2SGX60CF780C5N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60CF780C3N disebabkan oleh Intel dan EP2SGX60CF780C5N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel
EP2SGX60CF780C3N ⚠ Bahagian terakhir untuk beliIntel
EP2SGX60CF780C5N - Stratix II GX FPGA, 60K LE, 6.375 Gbps SERDES | Intel
EP2SGX60CF780C5N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2SGX60CF780C3N | EP2SGX60CF780C5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | 60,440 (60K LE) |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 3022 |
| User I/O Pins | 364 | — |
| Embedded Memory (bits) | 2,544,192 | — |
| Number of CLBs | 60,440 | — |
| Internal Frequency (max) | 816.9 MHz | 717 MHz |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| Transceiver Channels | 12 (up to 6.375 Gbps) | — |
| Package Type | 780-ball FC-FBGA | — |
| Package Dimensions | 29 mm x 29 mm, 1.0 mm pitch | — |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Status RoHS | Lead-free / Compliant | Compliant |
| Total RAM Bits | — | 2,544,192 (approximately 2.5 Mbit) |
| User I/Os | — | 364 |
| High-Speed Transceiver Channels | — | 20 (up to 6.375 Gbps per channel) |
| Core Voltage | — | 1.15 V to 1.25 V |
| Kemasan | — | 780-BBGA, FCBGA (29 mm x 29 mm, 1.0 mm pitch) |
| Jenis Pemasangan | — | Surface Mount |
| Configuration Interface | — | JTAG (IEEE 1149.1), passive/active serial |
| Operating Temperature Grade | — | Commercial (C) |
| Transceiver Data Rate | — | Up to 6.375 Gbps |