EP2SGX60CF780C3N vs EP2SGX60CF780C5N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60CF780C3N sa pamamagitan ng Intel at EP2SGX60CF780C5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel
EP2SGX60CF780C3N ⚠ Huling PagbiliIntel
EP2SGX60CF780C5N - Stratix II GX FPGA, 60K LE, 6.375 Gbps SERDES | Intel
EP2SGX60CF780C5N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX60CF780C3N | EP2SGX60CF780C5N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | 60,440 (60K LE) |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 3022 |
| User I/O Pins | 364 | — |
| Embedded Memory (bits) | 2,544,192 | — |
| Number of CLBs | 60,440 | — |
| Internal Frequency (max) | 816.9 MHz | 717 MHz |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| Transceiver Channels | 12 (up to 6.375 Gbps) | — |
| Package Type | 780-ball FC-FBGA | — |
| Package Dimensions | 29 mm x 29 mm, 1.0 mm pitch | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Tindminan RoHS | Lead-free / Compliant | Compliant |
| Total RAM Bits | — | 2,544,192 (approximately 2.5 Mbit) |
| User I/Os | — | 364 |
| High-Speed Transceiver Channels | — | 20 (up to 6.375 Gbps per channel) |
| Core Voltage | — | 1.15 V to 1.25 V |
| Packhaging | — | 780-BBGA, FCBGA (29 mm x 29 mm, 1.0 mm pitch) |
| Uri ng Pagpapasok | — | Surface Mount |
| Configuration Interface | — | JTAG (IEEE 1149.1), passive/active serial |
| Operating Temperature Grade | — | Commercial (C) |
| Transceiver Data Rate | — | Up to 6.375 Gbps |