EP2SGX60EF1152I3N vs EP2SGX60EF1152C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60EF1152I3N disebabkan oleh Intel dan EP2SGX60EF1152C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2SGX60EF1152I3N EP2SGX60EF1152C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Obsolete
Family Stratix II GX Stratix II GX
Device Type Field-Programmable Gate Array (FPGA) —
Logic Elements (LEs) 60,440 —
Configurable Logic Blocks (CLBs) 60,440 —
Embedded Memory Bits 2,544,192 bits —
Internal Frequency (max) 717 MHz —
Process Technology 90 nm 90 nm CMOS
Core Voltage 1.2 V —
Package Type 1152-ball FC-FBGA —
Package Size 35 x 35 mm (1 mm ball pitch) —
Number of Terminals 1152 —
Terminal Form Ball —
Temperature Grade Industrial (-40C to +100C junction) —
Lead-Free Yes —
Status RoHS Compliant —
Aras MSL [DATA_NEEDED: MSL level] —
Jenis Pemasangan Surface Mount (BGA) Surface Mount (BGA)
Series — Stratix II
Logic Elements — 60,440
Adaptive Logic Modules (ALMs) — 30,220
Logic Array Blocks (LABs) — 3022
Embedded Memory (bits) — 2,544,192
Maximum User I/Os — 534
Core Voltage (Vcc) — 1.2 V
Maximum Internal Frequency — 717 MHz
Propagation Delay — 0.40 ns
Embedded Multipliers (18x18) — [DATA_NEEDED: embedded multiplier count]
PLLs — 4
Transceiver Data Rate — 3.125 Gbps per channel
Kemasan — 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch
Speed Grade — C3 (commercial, -3 bin)
Suhu Operasi — 0C to +85C (commercial)

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