EP2SGX60EF1152I3N vs EP2SGX60EF1152C3N 比較

詳細並排比較 EP2SGX60EF1152I3N 由 Intel 與 EP2SGX60EF1152C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2SGX60EF1152I3N EP2SGX60EF1152C3N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete Obsolete
Family Stratix II GX Stratix II GX
Device Type Field-Programmable Gate Array (FPGA) —
Logic Elements (LEs) 60,440 —
Configurable Logic Blocks (CLBs) 60,440 —
Embedded Memory Bits 2,544,192 bits —
Internal Frequency (max) 717 MHz —
Process Technology 90 nm 90 nm CMOS
Core Voltage 1.2 V —
Package Type 1152-ball FC-FBGA —
Package Size 35 x 35 mm (1 mm ball pitch) —
Number of Terminals 1152 —
Terminal Form Ball —
Temperature Grade Industrial (-40C to +100C junction) —
Lead-Free Yes —
RoHS 狀態 Compliant —
MSL 等級 [DATA_NEEDED: MSL level] —
安裝類型 Surface Mount (BGA) Surface Mount (BGA)
Series — Stratix II
Logic Elements — 60,440
Adaptive Logic Modules (ALMs) — 30,220
Logic Array Blocks (LABs) — 3022
Embedded Memory (bits) — 2,544,192
Maximum User I/Os — 534
Core Voltage (Vcc) — 1.2 V
Maximum Internal Frequency — 717 MHz
Propagation Delay — 0.40 ns
Embedded Multipliers (18x18) — [DATA_NEEDED: embedded multiplier count]
PLLs — 4
Transceiver Data Rate — 3.125 Gbps per channel
封裝 — 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch
Speed Grade — C3 (commercial, -3 bin)
工作溫度 — 0C to +85C (commercial)

資料表與資源

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