EP2SGX60EF1152I4 vs EP2SGX60EF1152C5N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60EF1152I4 disebabkan oleh Intel dan EP2SGX60EF1152C5N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX60EF1152C5N - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
EP2SGX60EF1152C5N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2SGX60EF1152I4 | EP2SGX60EF1152C5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | — |
| Logic Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | 3022 |
| Embedded Memory | 2,544,192 bits | — |
| User I/O Pins | 534 | — |
| Maximum Internal Frequency | 717 MHz (per data source) | — |
| Maximum Operating Frequency | 732.1 MHz (per data source) | 609.76 MHz |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| Kemasan | 1152-ball FC-FBGA (flip-chip fine-pitch BGA) | 1152-ball FC-FBGA |
| Package Dimensions | 23 x 23 mm, 1 mm pitch (per data source) | — |
| Temperature Grade | Industrial | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Family | — | Stratix II GX |
| Logic Elements (LE) | — | 60,440 |
| Embedded Memory Bits | — | 2,544,192 |
| User I/O Count | — | 534 |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | -5 (mid) |
| Suhu Operasi | — | Commercial (0C to +85C) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |