EP2SGX90FF1508C3ES vs EP2SGX90FF1508C4ES Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX90FF1508C3ES disebabkan oleh Intel dan EP2SGX90FF1508C4ES disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2SGX90FF1508C3ES EP2SGX90FF1508C4ES
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete NRND
Family Stratix II GX Stratix II GX
Logic Elements 90,960 —
Logic Array Blocks (LABs) 4,828 4828
Embedded Memory (TriMatrix) 4,520,448 bits —
Total RAM Bits 4,520,448 —
Process Technology 90 nm CMOS 90 nm CMOS
Core Supply Voltage 1.2 V —
Maximum Internal Frequency 816.9 MHz 717 MHz
DSP Blocks Yes (dedicated multiplier blocks) —
Embedded Transceivers Up to 3.125 Gbps multi-gigabit transceivers —
Global Clock Networks Up to 16 —
Regional Clock Networks Up to 32 per device region —
Kemasan 1508-ball FC-FBGA (Flip-Chip FineLine BGA), 1.00 mm pitch —
Jenis Pemasangan Surface Mount —
Configuration Interface JTAG / EPCS serial flash / Passive parallel —
Operating Temperature Grade Commercial / Industrial (per part suffix) —
Status RoHS [DATA_NEEDED: rohs] Compliant (verify by date code)
Logic Elements / Cells — 90960
Configurable Logic Blocks (CLBs) — 4828
Core Supply Voltage (VCCINT) — 1.2 V (1.15 V to 1.25 V)
Transceivers — 12 channels at up to 6.375 Gbps
Embedded Memory — 4828 Kbit TriMatrix memory blocks
Embedded Multipliers — 252 (18x18)
User I/O Pins — 650 (approx.)
Package Type — 1508-ball FC-FBGA
Package Code — MS-034AAR-1, FBGA-1508, 40 x 40 mm, 1 mm pitch
Suhu Operasi — 0 C to 85 C (Commercial / Extended)
Grade — Engineering Sample (ES)

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