EP3C10F256C6 vs EP3C10F256I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C10F256C6 disebabkan oleh Intel dan EP3C10F256I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C10F256C6 | EP3C10F256I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 10,320 | 10,320 |
| Total Memory Bits | 423,936 bits | 423,936 |
| Embedded 18x18 Multipliers | 23 | 46 |
| PLLs | 2 | 2 |
| Maximum User I/Os | 182 | — |
| Kemasan | 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) | 256-LBGA (FineLine BGA) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V (typ. 1.2 V) | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Process Technology | 60 nm low-power CMOS | 65 nm |
| Configuration Memory | SRAM-based (external EPCS flash required) | — |
| Suhu Operasi | -40 C to +125 C (industrial, suffix 'C') | -40C to +125C (Industrial) |
| Speed Grade | 6 | — |
| Status RoHS | Compliant (lead-free FBGA) | Compliant |
| Aras MSL | 3 (168 hours) | 3 |
| Device Type | — | FPGA |
| Logic Blocks | — | 10,320 |
| Embedded Memory | — | 423,936 bits |
| Maximum User I/O | — | 182 |
| Core Voltage | — | 1.2 V |
| Lead Free | — | Yes |