EP3C10F256C6 vs EP3C10F256I7N 比較
詳細並排比較 EP3C10F256C6 由 Intel 與 EP3C10F256I7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3C10F256C6 | EP3C10F256I7N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 10,320 | 10,320 |
| Total Memory Bits | 423,936 bits | 423,936 |
| Embedded 18x18 Multipliers | 23 | 46 |
| PLLs | 2 | 2 |
| Maximum User I/Os | 182 | — |
| 封裝 | 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) | 256-LBGA (FineLine BGA) |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V (typ. 1.2 V) | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Process Technology | 60 nm low-power CMOS | 65 nm |
| Configuration Memory | SRAM-based (external EPCS flash required) | — |
| 工作溫度 | -40 C to +125 C (industrial, suffix 'C') | -40C to +125C (Industrial) |
| Speed Grade | 6 | — |
| RoHS 狀態 | Compliant (lead-free FBGA) | Compliant |
| MSL 等級 | 3 (168 hours) | 3 |
| Device Type | — | FPGA |
| Logic Blocks | — | 10,320 |
| Embedded Memory | — | 423,936 bits |
| Maximum User I/O | — | 182 |
| Core Voltage | — | 1.2 V |
| Lead Free | — | Yes |