EP3C16F256I7N vs EP3C10F256I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C16F256I7N disebabkan oleh Intel dan EP3C10F256I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C16F256I7N | EP3C10F256I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 15408 | — |
| Logic Array Blocks (LABs) | 963 | — |
| Total Memory Bits | 516096 | 423,936 |
| Embedded Memory | 56 M9K blocks (504 Kbit) | 423,936 bits |
| Embedded 18x18 Multipliers | 56 | 46 |
| PLLs | 4 | 2 |
| Maximum User I/O Pins | 168 | — |
| Kemasan | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-LBGA (FineLine BGA) |
| Suhu Operasi | -40C to +100C (industrial, I7) | -40C to +125C (Industrial) |
| Supply Voltage (Core) | 1.2 V typical | — |
| Process Technology | TSMC 60 nm low-leakage | 65 nm |
| Configuration | SRAM-based, requires external config device (EPCS/EPCQ) | — |
| Lead-Free / Pb-Free | Yes (N suffix per JEDEC JESD97) | — |
| RoHS Compliance | Compliant | — |
| Device Type | — | FPGA |
| Logic Elements (LE) | — | 10,320 |
| Logic Blocks | — | 10,320 |
| Maximum User I/O | — | 182 |
| Core Voltage | — | 1.2 V |
| Jenis Pemasangan | — | Surface Mount |
| Status RoHS | — | Compliant |
| Lead Free | — | Yes |
| Aras MSL | — | 3 |