EP3C16F256I7N vs EP3C10F256I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C16F256I7N sa pamamagitan ng Intel at EP3C10F256I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C16F256I7N | EP3C10F256I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 15408 | — |
| Logic Array Blocks (LABs) | 963 | — |
| Total Memory Bits | 516096 | 423,936 |
| Embedded Memory | 56 M9K blocks (504 Kbit) | 423,936 bits |
| Embedded 18x18 Multipliers | 56 | 46 |
| PLLs | 4 | 2 |
| Maximum User I/O Pins | 168 | — |
| Packhaging | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-LBGA (FineLine BGA) |
| Temperature na Operasyon | -40C to +100C (industrial, I7) | -40C to +125C (Industrial) |
| Supply Voltage (Core) | 1.2 V typical | — |
| Process Technology | TSMC 60 nm low-leakage | 65 nm |
| Configuration | SRAM-based, requires external config device (EPCS/EPCQ) | — |
| Lead-Free / Pb-Free | Yes (N suffix per JEDEC JESD97) | — |
| RoHS Compliance | Compliant | — |
| Device Type | — | FPGA |
| Logic Elements (LE) | — | 10,320 |
| Logic Blocks | — | 10,320 |
| Maximum User I/O | — | 182 |
| Core Voltage | — | 1.2 V |
| Uri ng Pagpapasok | — | Surface Mount |
| Tindminan RoHS | — | Compliant |
| Lead Free | — | Yes |
| Level ng MSL | — | 3 |