EP3C25F324C7N vs EP3C25F324C6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C25F324C7N disebabkan oleh Intel dan EP3C25F324C6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C25F324C7N | EP3C25F324C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Device Family | Cyclone III | — |
| Logic Cells | 24,624 cells | — |
| Embedded Memory | 608,256 bits | — |
| Available I/O Pins | 215 I/O | — |
| Maximum Listed Frequency | 437.5 MHz | — |
| Process Technology | 65 nm | TSMC 65 nm low-power (LP) |
| Core Voltage | 1.2 V | — |
| Kemasan | 324-ball FBGA | 324-BGA (FBGA-324), fine-pitch |
| Terminal Count | 324 terminals | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Package Shape | Rectangular | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Temperature Grading | Other | — |
| Programmability | Field programmable | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Series | — | Cyclone III |
| Family | — | Cyclone III (low-power, low-cost FPGA) |
| Logic Elements (LE) | — | 24,624 |
| Total Memory Bits | — | 608,256 bits |
| Embedded Memory Blocks | — | M9K blocks, 66 total |
| Embedded Multipliers | — | 66 (18x18) |
| DSP Blocks | — | 66 dedicated 18x18 multipliers |
| User I/O Pins | — | 215 |
| Number of I/O Banks | — | 8 |
| PLLs | — | 4 general-purpose PLLs |
| Speed Grade | — | C6 (commercial) |
| Suhu Operasi | — | 0C to +85C (commercial) |
| Configuration Schemes | — | Passive Serial, Fast Passive Parallel, JTAG |
| Lead-Free / RoHS | — | Yes (lead-free, RoHS compliant) |