EP3C40F780I8N vs EP3C40F780C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C40F780I8N disebabkan oleh Intel dan EP3C40F780C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C40F780I8N | EP3C40F780C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Device Logic Elements | 39,600 | — |
| Logic Array Blocks (LABs/CLBs) | 2,475 | — |
| Embedded Memory (bits) | 1,161,216 | — |
| Embedded Memory (Kbits) | 1,134 | — |
| Embedded Multipliers (18x18) | 126 | — |
| Number of PLLs | 4 | 4 |
| User I/O Pins | 535 | — |
| I/O Banks | 20 | — |
| Nominal Core Supply Voltage | 1.2 V (1.15 V to 1.25 V) | — |
| Kemasan | 780-ball FBGA (F780) | 780-ball FBGA, 1.0mm pitch |
| Package Ball Pitch | 1.0 mm | — |
| Process Technology | TSMC 65 nm low-power CMOS | 65nm TSMC low-power |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C junction) | — |
| Configuration Modes | Passive Serial, Active Serial (EPCS), JTAG, Fast Passive Parallel | AS, PS, FPP, JTAG |
| Status RoHS | Compliant | Compliant |
| Aras MSL | 3 | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Series | — | Cyclone® III |
| Logic Elements (LE) | — | 39,600 |
| Total Memory Bits | — | 1,161,216 bits |
| Number of LABs/CLBs | — | 2,475 |
| Embedded Memory Blocks | — | M9K x 126 |
| Embedded 18x18 Multipliers | — | 126 (up to 396 9x9) |
| Maximum User I/Os | — | 535 |
| Number of I/O Banks | — | 9 |
| Core Voltage | — | 1.15V to 1.25V |
| Suhu Operasi | — | 0°C to +85°C (Commercial) |
| Speed Grade | — | 8 (C8) |