EP3C55F484I7 vs EP3C55F484C7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C55F484I7 disebabkan oleh Intel dan EP3C55F484C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C55F484I7 | EP3C55F484C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | — |
| Manufacturer | Intel (formerly Altera) | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements / Cells | 55,856 | — |
| Adaptive Logic Modules (ALMs) | 3,491 | — |
| Number of Logic Array Blocks (LABs) | 3,491 | — |
| Number of I/O | 327 | — |
| Embedded Memory (bits) | 2,396,160 (2,340 Kbits) | 2,396,160 |
| Number of Logic Blocks / CLBs | 55856 | — |
| Embedded Multipliers (18 × 18) | 156 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Internal Maximum Frequency | 472.5 MHz | — |
| Core Voltage | 1.2 V | — |
| Suhu Operasi | -40 °C to +100 °C (Industrial grade, I-suffix) | 0C to 85C (Commercial) |
| Kemasan | 484-FBGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-FBGA (FineLine BGA) |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Status RoHS | Lead-Free, RoHS Compliant | Compliant |
| Aras MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Process Technology | CMOS (Cyclone III low-power 65 nm family) | 60 nm TSMC low-power |
| Family | — | Cyclone III |
| Logic Elements | — | 55,856 |
| Maximum User I/O | — | 327 |
| Number of LABs/CLBs | — | 3,491 |
| Embedded Multipliers (18x18) | — | 156 |
| Speed Grade | — | 7 |
| Configuration Modes | — | JTAG, AS, AP, PS |
| Encryption | — | AES-256 |
| Tegangan Pemberi Arus | — | 1.2 V core (VCCINT) |