EP3C55F484I7 vs EP3C55F484C7N 比較
詳細並排比較 EP3C55F484I7 由 Intel 與 EP3C55F484C7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3C55F484I7 | EP3C55F484C7N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Series | Cyclone III | — |
| Manufacturer | Intel (formerly Altera) | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements / Cells | 55,856 | — |
| Adaptive Logic Modules (ALMs) | 3,491 | — |
| Number of Logic Array Blocks (LABs) | 3,491 | — |
| Number of I/O | 327 | — |
| Embedded Memory (bits) | 2,396,160 (2,340 Kbits) | 2,396,160 |
| Number of Logic Blocks / CLBs | 55856 | — |
| Embedded Multipliers (18 × 18) | 156 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Internal Maximum Frequency | 472.5 MHz | — |
| Core Voltage | 1.2 V | — |
| 工作溫度 | -40 °C to +100 °C (Industrial grade, I-suffix) | 0C to 85C (Commercial) |
| 封裝 | 484-FBGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-FBGA (FineLine BGA) |
| 安裝類型 | Surface Mount (BGA) | — |
| RoHS 狀態 | Lead-Free, RoHS Compliant | Compliant |
| MSL 等級 | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Process Technology | CMOS (Cyclone III low-power 65 nm family) | 60 nm TSMC low-power |
| Family | — | Cyclone III |
| Logic Elements | — | 55,856 |
| Maximum User I/O | — | 327 |
| Number of LABs/CLBs | — | 3,491 |
| Embedded Multipliers (18x18) | — | 156 |
| Speed Grade | — | 7 |
| Configuration Modes | — | JTAG, AS, AP, PS |
| Encryption | — | AES-256 |
| 供應電壓 | — | 1.2 V core (VCCINT) |