EP3C55U484C7 vs EP3C55U484C6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C55U484C7 disebabkan oleh Intel dan EP3C55U484C6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C55U484C7 | EP3C55U484C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone III | — |
| Logic Elements (LEs) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,488 | — |
| Embedded Memory (bits) | 2,396,160 | — |
| Embedded Multipliers (18x18) | 156 | — |
| Maximum User I/O Pins | 327 | — |
| Number of PLLs | 4 | — |
| Maximum Operating Frequency | 437 MHz | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltages | 1.2 V / 2.5 V / 3.0 V / 3.3 V | — |
| Kemasan | 484-ball UBGA (Ultra-FineLine BGA) | 484-FBGA |
| Package Dimensions | 19 x 19 mm | — |
| Ball Pitch | 0.80 mm | — |
| Speed Grade | C7 (Commercial) | — |
| Suhu Operasi | 0C to +85C (Commercial) | [DATA_NEEDED: operating temperature range] |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Family | — | Cyclone III |
| Logic Elements | — | 55856 LE |
| Number of Logic Cells | — | 55856 cells |
| Embedded Memory | — | 2396160 bit |
| I/O Count | — | 327 I/O |
| Core Technology Voltage | — | 1.2 V |
| JTAG LVTTL/LVCMOS Operation | — | 3.3 V, 3.0 V, 2.5 V |
| Package Code | — | FBGA |
| Terminal Count | — | 484 |
| Terminal Form | — | Ball |
| Clock Rate | — | 437.5 MHz |
| REACH Status | — | unknown |
| Automotive Qualification | — | unknown |
| Lead-Free Status | — | unknown |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Maximum I/O Voltage | — | [DATA_NEEDED: maximum I/O voltage] |
| Tegangan Panas | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |