EP3C55U484C7 vs EP3C55U484C6N Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP3C55U484C7 tarafından Intel ve EP3C55U484C6N tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | EP3C55U484C7 | EP3C55U484C6N |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Series | Cyclone III | — |
| Logic Elements (LEs) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,488 | — |
| Embedded Memory (bits) | 2,396,160 | — |
| Embedded Multipliers (18x18) | 156 | — |
| Maximum User I/O Pins | 327 | — |
| Number of PLLs | 4 | — |
| Maximum Operating Frequency | 437 MHz | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltages | 1.2 V / 2.5 V / 3.0 V / 3.3 V | — |
| Paket | 484-ball UBGA (Ultra-FineLine BGA) | 484-FBGA |
| Package Dimensions | 19 x 19 mm | — |
| Ball Pitch | 0.80 mm | — |
| Speed Grade | C7 (Commercial) | — |
| İşletim Sıcaklığı | 0C to +85C (Commercial) | [DATA_NEEDED: operating temperature range] |
| Montaj Türü | Surface Mount (BGA) | Surface Mount |
| RoHS Durumu | Compliant | Compliant |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Family | — | Cyclone III |
| Logic Elements | — | 55856 LE |
| Number of Logic Cells | — | 55856 cells |
| Embedded Memory | — | 2396160 bit |
| I/O Count | — | 327 I/O |
| Core Technology Voltage | — | 1.2 V |
| JTAG LVTTL/LVCMOS Operation | — | 3.3 V, 3.0 V, 2.5 V |
| Package Code | — | FBGA |
| Terminal Count | — | 484 |
| Terminal Form | — | Ball |
| Clock Rate | — | 437.5 MHz |
| REACH Status | — | unknown |
| Automotive Qualification | — | unknown |
| Lead-Free Status | — | unknown |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Maximum I/O Voltage | — | [DATA_NEEDED: maximum I/O voltage] |
| Termal Direnç | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |