EP3C55U484C7N vs EP3C55U484C6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C55U484C7N disebabkan oleh Intel dan EP3C55U484C6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C55U484C7N | EP3C55U484C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Cyclone III | — |
| Logic Elements | 55,856 | 55856 LE |
| Embedded Memory Bits | 2,396,160 (2.4 Mbit) | — |
| Maximum User I/Os | 327 | — |
| I/O Banks | 8 | — |
| DSP Blocks (18 x 18 Multipliers) | 156 (260 multipliers reported by some sources - [DATA_NEEDED: confirm multiplier count from device handbook]) | — |
| PLLs | 4 | — |
| M9K Memory Blocks | 260 | — |
| Process Technology | 65 nm low-power CMOS | 65 nm |
| Core Voltage (VCCINT) | 1.2 V | — |
| Suhu Operasi | 0 °C to +85 °C (commercial) | [DATA_NEEDED: operating temperature range] |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Kemasan | 484-pin UBGA (Ultra FineLine BGA), 19 mm × 19 mm | 484-FBGA |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Status RoHS | Compliant | Compliant |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Family | — | Cyclone III |
| Number of Logic Cells | — | 55856 cells |
| Embedded Memory | — | 2396160 bit |
| I/O Count | — | 327 I/O |
| Core Technology Voltage | — | 1.2 V |
| JTAG LVTTL/LVCMOS Operation | — | 3.3 V, 3.0 V, 2.5 V |
| Package Code | — | FBGA |
| Terminal Count | — | 484 |
| Terminal Form | — | Ball |
| Clock Rate | — | 437.5 MHz |
| REACH Status | — | unknown |
| Automotive Qualification | — | unknown |
| Lead-Free Status | — | unknown |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Maximum I/O Voltage | — | [DATA_NEEDED: maximum I/O voltage] |
| Tegangan Panas | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |