EP3CLS100F484C7N vs EP3CLS200F484C7N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS100F484C7N disebabkan oleh Intel dan EP3CLS200F484C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3CLS100F484C7N EP3CLS200F484C7N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Cyclone III LS —
Logic Elements 100,448 —
Embedded Memory (bits) 4,451,328 —
User I/O Pins 278 —
DSP Blocks (18x18 multipliers) [DATA_NEEDED: DSP block count] —
PLLs 4 4
Global Clock Networks [DATA_NEEDED: global clock count] —
Process Technology 65 nm low-power (TSMC) 65 nm low-power CMOS
Core Supply Voltage 1.2 V —
Operating Temperature (junction) 0°C to +85°C (commercial) —
Speed Grade C7 —
Kemasan 484-ball FineLine BGA (FBGA-484) 484-ball FBGA (FineLine BGA, 23x23 mm)
Ball Pitch 1.0 mm —
Package Dimensions [DATA_NEEDED: package body dimensions] —
Configuration Method SRAM-based (volatile), via EPCS/JTAG/parallel flash —
Security Features Bitstream encryption, JTAG tamper protection —
Jenis Pemasangan Surface Mount Surface Mount
Status RoHS Compliant (lead-free, N suffix) Compliant
Design Software Quartus II / Intel Quartus Prime —
Series — Cyclone III LS
Logic Elements (LE) — 198,464
Logic Array Blocks (LAB) — 12,404
Embedded Memory — 8,211,456 bits
Embedded 18x18 Multipliers — 210
User I/O — 226
Core Voltage — 1.2 V
Suhu Operasi — 0C to +85C (commercial)
Configuration Modes — AS, PS, JTAG (IEEE 1149.1)
I/O Standards — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Number of I/O Banks — 8
Hot Socketing — Supported

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