EP3CLS200F484I7N vs EP3CLS200F484C7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3CLS200F484I7N disebabkan oleh Intel dan EP3CLS200F484C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3CLS200F484I7N | EP3CLS200F484C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Family | Cyclone III LS | — |
| Logic Elements (LEs) | 198,464 | — |
| Embedded Memory Bits | 8,211,456 | — |
| Maximum User I/O | 210 | — |
| Maximum Operating Frequency | 437.5 MHz | — |
| Process Technology | 65 nm | 65 nm low-power CMOS |
| Core Supply Voltage | 1.2 V | — |
| Package Type | FBGA-484 | — |
| Pin/Ball Count | 484 | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Speed Grade | 7 | — |
| Status RoHS | Compliant | Compliant |
| Configuration Scheme | FPGA (SRAM-based, external configuration) | — |
| Hardware Crypto Accelerator | Yes (AES, SHA - LS family feature) | — |
| Series | — | Cyclone III LS |
| Logic Elements (LE) | — | 198,464 |
| Logic Array Blocks (LAB) | — | 12,404 |
| Embedded Memory | — | 8,211,456 bits |
| Embedded 18x18 Multipliers | — | 210 |
| User I/O | — | 226 |
| Kemasan | — | 484-ball FBGA (FineLine BGA, 23x23 mm) |
| Core Voltage | — | 1.2 V |
| Configuration Modes | — | AS, PS, JTAG (IEEE 1149.1) |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Number of I/O Banks | — | 8 |
| Hot Socketing | — | Supported |
| PLLs | — | 4 |