EP3SE110F1152C3 vs EP3SE110F1152C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F1152C3 disebabkan oleh Altera dan EP3SE110F1152C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE110F1152C3N EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE110F1152C3 EP3SE110F1152C3N
Merek Altera Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Masa Terakhir Dibeli
Family Stratix III E Stratix III E
Logic Elements 107,500 —
Logic Array Blocks (LABs) 4,300 4,300
Adaptive Logic Modules (ALMs) 43,040 —
Total Block Memory Bits 8,936,448 —
User I/Os 744 744
Internal Operating Frequency (max) 800 MHz —
Core Supply Voltage 0.9 V 1.1 V nominal
Suhu Operasi 0 C to 85 C 0 °C to 85 °C (commercial)
Kemasan 1152-BBGA, FCBGA —
Jenis Pemasangan Surface Mount (Flip-Chip BGA) Surface Mount
Status RoHS Compliant —
Aras MSL [DATA_NEEDED: moisture sensitivity level] —
Process Node 40 nm —
Speed Grade C3 (commercial, slower speed grade) C3
Series — Stratix III
Logic Elements (LE) — 107,500
Total RAM Bits — 8,936,448
Operating Frequency (max) — 500 MHz
I/O Supply Voltage — [DATA_NEEDED: I/O supply range]
Process Technology — 65 nm TSMC
Package Type — FC-FBGA-1152 (flip-chip BGA)
Gaya Pemasangan — SMD/SMT (Tray)
DSP Blocks — Yes (embedded multipliers)
Jenis Ingatan — M9K and M144K block RAM
External Memory Support — DDR/DDR2/DDR3 with read/write leveling
Boundary Scan — IEEE 1149.1 (JTAG)
RoHS — [DATA_NEEDED: RoHS status]
Lead-Free — Yes (per Altera/Intel datasheet family convention)

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