EP3SE110F1152C4 vs EP3SE260F1152C2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F1152C4 disebabkan oleh Intel dan EP3SE260F1152C2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
EP3SE110F1152C4 ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EP3SE110F1152C4 | EP3SE260F1152C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Obsolete |
| Family | Stratix III E | — |
| Logic Elements | 107,500 | — |
| Embedded Memory | 8,936,448 bits | — |
| Maximum User I/Os | 744 | — |
| DSP Blocks | [DATA_NEEDED: 18x18 multiplier count] | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 10,200 |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage | 1.1 V | — |
| Maximum Performance | 450 MHz | — |
| Package Type | 1152-ball FCBGA (Flip-Chip BGA) | — |
| Operating Temperature Grade | Commercial (C4) | — |
| Configuration Memory | SRAM-based (volatile) | — |
| On-chip Termination | Dynamic, programmable | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL | — |
| Status RoHS | Compliant | Compliant |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix® III E |
| Logic Elements (LE) | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/Os | — | 744 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | — | 1.1 V |
| Kemasan | — | 1152-ball FC-FBGA (Flip Chip) |
| Jenis Pemasangan | — | Surface Mount |
| Speed Grade | — | C2 (commercial) |
| Suhu Operasi | — | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Lead-Free | — | Yes |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |