EP3SE110F780C4L vs EP3SL110F780C2N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F780C4L disebabkan oleh Intel dan EP3SL110F780C2N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SL110F780C2N - Stratix III L FPGA, 107K LE, 780-FCBGA | Intel
EP3SL110F780C2N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE110F780C4L | EP3SL110F780C2N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Series | Stratix III E | Stratix III |
| Number of Logic Elements (LE) | 107,500 | — |
| Number of Logic Array Blocks (LAB) | [DATA_NEEDED: number of LABs] | — |
| Total Memory Bits | 8,936,448 bits | 4992000 |
| Number of 18x18 Multipliers | 488 | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| User I/O Pins | 488 | — |
| Speed Grade | -4 (commercial) | C2 |
| Process Variant | L (low-leakage) | — |
| Suhu Operasi | 0C to +85C (commercial) | 0C to +85C (Commercial, C2 suffix) |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | — |
| Package Type | 780-Ball FCBGA | — |
| Ball Pitch | 1.0 mm | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Process Technology | 65 nm CMOS | — |
| Status RoHS | Compliant | Compliant |
| Aras MSL | 3 (per JEDEC J-STD-020) | — |
| Family | — | Stratix III L |
| Logic Elements (LEs) | — | 107500 |
| LABs / CLBs | — | 4300 |
| Number of I/O | — | 488 |
| Tegangan Pemberi Arus | — | 0.95 V, 1.1 V, 1.8 V, 2.5 V, 3.3 V (multi-rail) |
| Kemasan | — | 780-BGA, FCBGA |
| Lead-Free | — | Yes |
| Boson Bebas | — | [DATA_NEEDED: halogen-free status] |
| Process Node | — | 40 nm |
| Embedded Multipliers (18x18) | — | 312 |
| Configuration Interface | — | JTAG, Active Serial, Active Parallel |