EP3SE110F780C4L vs EP3SL110F780C2N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F780C4L sa pamamagitan ng Intel at EP3SL110F780C2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL110F780C2N - Stratix III L FPGA, 107K LE, 780-FCBGA | Intel
EP3SL110F780C2N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE110F780C4L | EP3SL110F780C2N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Series | Stratix III E | Stratix III |
| Number of Logic Elements (LE) | 107,500 | — |
| Number of Logic Array Blocks (LAB) | [DATA_NEEDED: number of LABs] | — |
| Total Memory Bits | 8,936,448 bits | 4992000 |
| Number of 18x18 Multipliers | 488 | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| User I/O Pins | 488 | — |
| Speed Grade | -4 (commercial) | C2 |
| Process Variant | L (low-leakage) | — |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (Commercial, C2 suffix) |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | — |
| Package Type | 780-Ball FCBGA | — |
| Ball Pitch | 1.0 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Process Technology | 65 nm CMOS | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 (per JEDEC J-STD-020) | — |
| Family | — | Stratix III L |
| Logic Elements (LEs) | — | 107500 |
| LABs / CLBs | — | 4300 |
| Number of I/O | — | 488 |
| Volte ng Pagbibigay | — | 0.95 V, 1.1 V, 1.8 V, 2.5 V, 3.3 V (multi-rail) |
| Packhaging | — | 780-BGA, FCBGA |
| Lead-Free | — | Yes |
| Wala sa Halogen | — | [DATA_NEEDED: halogen-free status] |
| Process Node | — | 40 nm |
| Embedded Multipliers (18x18) | — | 312 |
| Configuration Interface | — | JTAG, Active Serial, Active Parallel |