EP3SE260F1152C3N vs EP3SE260F1152C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C3N disebabkan oleh Intel dan EP3SE260F1152C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ AktifIntel
EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera
EP3SE260F1152C3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260F1152C3N | EP3SE260F1152C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Series | Stratix III E | Stratix III E |
| Logic Elements / Cells | 255,000 | — |
| Embedded Memory Bits | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| User I/O Count | 744 | — |
| Kemasan | 1152-BBGA, FCBGA | 1152-ball FCBGA (Flip-Chip BGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Process Technology | 65 nm | 40 nm |
| Core Voltage | 1.1 V | 0.9 V to 1.1 V |
| Suhu Operasi | 0 C to +85 C (Commercial) | 0C to +85C (Commercial) |
| Transceivers | Integrated high-speed transceivers | — |
| DSP Blocks | Yes (dedicated multiplier/accumulator) | — |
| Embedded Memory Type | TriMatrix (true dual-port, FIFO, ROM, RAM) | — |
| External Memory Support | DDR3, DDR2, QDR II+, RLDRAM II | — |
| Configuration Modes | AS, AP, PS, FPP, JTAG | — |
| Partial Reconfiguration | Supported | — |
| Programmable Power Technology | Yes (up to 50% dynamic power reduction) | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/Os | — | 744 |
| Embedded 18x18 Multipliers | — | 384 |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG |
| PLLs | — | 12 |
| Speed Grade | — | C3 |