EP3SE260F1152C4L vs EP3SE260F1152C2G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C4L disebabkan oleh Intel dan EP3SE260F1152C2G disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1152C4L - Stratix III E FPGA 255K LE 1152-FCBGA | Intel
EP3SE260F1152C4L ⚠ Bahagian terakhir untuk beliAltera
EP3SE260F1152C2G - Stratix III E 255K LE FPGA, 1152-FBGA, Lead-Free | Intel
EP3SE260F1152C2G ObsoletePengandingan Spesifikasi
| Parametr | EP3SE260F1152C4L | EP3SE260F1152C2G |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Obsolete |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 255,000 | — |
| Adaptive Logic Modules (ALMs) | 10,200 | — |
| Total Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/O Pins | 744 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 0.9 V | 1.1 V |
| Kemasan | 1152-ball FC-FBGA | 1152-BBGA, FCBGA (FineLine BGA) |
| Suhu Operasi | 0C to +85C (Commercial) | — |
| Maximum Frequency | 375 MHz | — |
| Transceivers | Integrated high-speed transceivers | — |
| Memory Interfaces | DDR2/DDR3 with hard controllers | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant (G suffix) |
| Series | — | EP3SE260 |
| Logic Elements / Cells | — | 255000 |
| Total RAM Bits | — | 16672768 |
| Number of LABs / CLBs | — | 10200 |
| Number of I/O | — | 744 |
| Number of Terminals | — | 1152 |
| Package Code | — | BGA (Ball Grid Array) |
| Package Shape | — | Square |
| Technology / Process Node | — | 65 nm |
| Speed Grade | — | C2 (commercial) |
| Lead-Free (RoHS) | — | Yes (G suffix) |
| Operating Temperature Grade | — | Commercial (C) |
| Supply Packaging | — | Tray |