EP3SE260F1152C4L vs EP3SE260F1152C2G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C4L sa pamamagitan ng Intel at EP3SE260F1152C2G sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SE260F1152C4L EP3SE260F1152C4L - Stratix III E FPGA 255K LE 1152-FCBGA | Intel

EP3SE260F1152C4L - Stratix III E FPGA 255K LE 1152-FCBGA | Intel

EP3SE260F1152C4L ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C4L EP3SE260F1152C2G
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Obsolete
Family Stratix III E Stratix III E
Logic Elements (LE) 255,000 —
Adaptive Logic Modules (ALMs) 10,200 —
Total Embedded Memory 16,672,768 bits (16.67 Mbit) —
User I/O Pins 744 —
Process Technology 65 nm CMOS —
Core Voltage 0.9 V 1.1 V
Packhaging 1152-ball FC-FBGA 1152-BBGA, FCBGA (FineLine BGA)
Temperature na Operasyon 0C to +85C (Commercial) —
Maximum Frequency 375 MHz —
Transceivers Integrated high-speed transceivers —
Memory Interfaces DDR2/DDR3 with hard controllers —
Configuration Modes Passive Serial, Fast Passive Parallel, JTAG —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Tindminan RoHS Compliant Compliant (G suffix)
Series — EP3SE260
Logic Elements / Cells — 255000
Total RAM Bits — 16672768
Number of LABs / CLBs — 10200
Number of I/O — 744
Number of Terminals — 1152
Package Code — BGA (Ball Grid Array)
Package Shape — Square
Technology / Process Node — 65 nm
Speed Grade — C2 (commercial)
Lead-Free (RoHS) — Yes (G suffix)
Operating Temperature Grade — Commercial (C)
Supply Packaging — Tray

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita