EP3SE260F1152C4LN vs EP3SE260F1152C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C4LN disebabkan oleh Intel dan EP3SE260F1152C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1152C4LN - Stratix III E FPGA 255K LE 1152-FCBGA | Intel
EP3SE260F1152C4LN ⚠ Bahagian terakhir untuk beliIntel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ AktifPengandingan Spesifikasi
| Parametr | EP3SE260F1152C4LN | EP3SE260F1152C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Family | Stratix III E | — |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| User I/Os | 744 | — |
| Kemasan | 1152-ball FC-BGA | 1152-BBGA, FCBGA |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 0.9 V | 1.1 V |
| Core Clock Speed | 375 MHz (max) | — |
| Transceiver Data Rate | 717 MHz | — |
| Speed Grade | C4 | — |
| Suhu Operasi | 0C to +85C (commercial) | 0 C to +85 C (Commercial) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | Compliant | Compliant |
| Series | — | Stratix III E |
| Logic Elements / Cells | — | 255,000 |
| Embedded Memory Bits | — | 16,672,768 bits |
| User I/O Count | — | 744 |
| Transceivers | — | Integrated high-speed transceivers |
| DSP Blocks | — | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | — | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |