EP3SE260F1517C2N vs EP3SE260F1517C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1517C2N disebabkan oleh Intel dan EP3SE260F1517C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1517C2N - Stratix III E FPGA 255K LE 1517-FCBGA | Intel
EP3SE260F1517C2N ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EP3SE260F1517C2N | EP3SE260F1517C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Family | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Total Memory Bits | 16,672,768 | — |
| Maximum User I/Os | 976 | — |
| Core Voltage | 1.1 V | 0.9 V |
| Process Technology | 65 nm | — |
| Maximum Core Frequency | 600 MHz | — |
| Kemasan | 1517-ball FC-BGA | 1517-BBGA, FCBGA (FineLine BGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial (0C to +85C) | Commercial (C suffix) |
| Configuration Interface | Passive Serial, Fast Passive Parallel, JTAG, Active Serial | — |
| Lead Free | Yes | — |
| Status RoHS | Compliant | Compliant |
| Speed Grade | C2 | 3 |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix III E |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 multipliers) | — | 768 |
| PLLs | — | 12 |
| Process Node | — | 65 nm (TSMC) |
| Package Pitch | — | 1.0 mm |
| Configuration | — | SRAM-based, requires external configuration device |