EP3SE260F1517C2N vs EP3SE260F1517C3 比較
詳細並排比較 EP3SE260F1517C2N 由 Intel 與 EP3SE260F1517C3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260F1517C2N | EP3SE260F1517C3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | 啟用中 |
| Family | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Total Memory Bits | 16,672,768 | — |
| Maximum User I/Os | 976 | — |
| Core Voltage | 1.1 V | 0.9 V |
| Process Technology | 65 nm | — |
| Maximum Core Frequency | 600 MHz | — |
| 封裝 | 1517-ball FC-BGA | 1517-BBGA, FCBGA (FineLine BGA) |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial (0C to +85C) | Commercial (C suffix) |
| Configuration Interface | Passive Serial, Fast Passive Parallel, JTAG, Active Serial | — |
| Lead Free | Yes | — |
| RoHS 狀態 | Compliant | Compliant |
| Speed Grade | C2 | 3 |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix III E |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 multipliers) | — | 768 |
| PLLs | — | 12 |
| Process Node | — | 65 nm (TSMC) |
| Package Pitch | — | 1.0 mm |
| Configuration | — | SRAM-based, requires external configuration device |