EP3SE260F1517C3 vs EP3SE260F1517C2N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1517C3 disebabkan oleh Intel dan EP3SE260F1517C2N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1517C2N - Stratix III E FPGA 255K LE 1517-FCBGA | Intel
EP3SE260F1517C2N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260F1517C3 | EP3SE260F1517C2N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | — |
| Core Voltage | 0.9 V | 1.1 V |
| Process Node | 65 nm (TSMC) | — |
| Kemasan | 1517-BBGA, FCBGA (FineLine BGA) | 1517-ball FC-BGA |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | Commercial (0C to +85C) |
| Speed Grade | 3 | C2 |
| Configuration | SRAM-based, requires external configuration device | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Family | — | Stratix III E |
| Total Memory Bits | — | 16,672,768 |
| Maximum User I/Os | — | 976 |
| Process Technology | — | 65 nm |
| Maximum Core Frequency | — | 600 MHz |
| Configuration Interface | — | Passive Serial, Fast Passive Parallel, JTAG, Active Serial |
| Lead Free | — | Yes |