EP3SE260F1517C3N vs EP3SE260F1517I4L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1517C3N disebabkan oleh Intel dan EP3SE260F1517I4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel
EP3SE260F1517C3N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260F1517C3N | EP3SE260F1517I4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Family | Stratix III E | Stratix III Enhanced (E) |
| Logic Elements | 254,400 | 255,000 |
| Embedded Memory | 16,672,768 bits (16.7 Mbits) | 16,672,768 bits (16.6 Mbits) |
| User I/Os | 976 | — |
| DSP Blocks (18x18 Multipliers) | 816 | 768 |
| M9K Memory Blocks | 1,040 | — |
| Maximum Transceiver Data Rate | 600 Mbps | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Kemasan | 1517-BBGA (FCBGA) | — |
| Process Technology | 65 nm TSMC low-power CMOS | 65 nm CMOS |
| Speed Grade | C3 (commercial) | I4 |
| Suhu Hubungan Operasi | 0 C to +85 C (commercial) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| External Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 | — |
| Series | — | Stratix III |
| Maximum User I/O | — | 976 |
| Package Type | — | 1517-BBGA, FCBGA |
| Package Dimensions | — | 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch) |
| Suhu Operasi | — | -40C to +100C (Industrial) |
| Temperature Grade | — | Industrial |
| Lead-Free / RoHS | — | Yes (L suffix) |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |
| Configuration Method | — | JTAG, Passive Serial, Fast Passive Parallel |
| Aras MSL | — | 3 (per JEDEC J-STD-020) |