EP3SE260F1517C3N vs EP3SE260F1517I4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C3N sa pamamagitan ng Intel at EP3SE260F1517I4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517C3N | EP3SE260F1517I4L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Family | Stratix III E | Stratix III Enhanced (E) |
| Logic Elements | 254,400 | 255,000 |
| Embedded Memory | 16,672,768 bits (16.7 Mbits) | 16,672,768 bits (16.6 Mbits) |
| User I/Os | 976 | — |
| DSP Blocks (18x18 Multipliers) | 816 | 768 |
| M9K Memory Blocks | 1,040 | — |
| Maximum Transceiver Data Rate | 600 Mbps | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Packhaging | 1517-BBGA (FCBGA) | — |
| Process Technology | 65 nm TSMC low-power CMOS | 65 nm CMOS |
| Speed Grade | C3 (commercial) | I4 |
| Temperature ng Junction na Operasyon | 0 C to +85 C (commercial) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| External Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 | — |
| Series | — | Stratix III |
| Maximum User I/O | — | 976 |
| Package Type | — | 1517-BBGA, FCBGA |
| Package Dimensions | — | 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch) |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Temperature Grade | — | Industrial |
| Lead-Free / RoHS | — | Yes (L suffix) |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |
| Configuration Method | — | JTAG, Passive Serial, Fast Passive Parallel |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |