EP3SE260F1517C4N vs EP3SE260F1517I4L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1517C4N disebabkan oleh Intel dan EP3SE260F1517I4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE260F1517C4N | EP3SE260F1517I4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Stratix® III E | Stratix III |
| Family | Field-Programmable Gate Array (FPGA) | Stratix III Enhanced (E) |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory | 16,672,768 bits | 16,672,768 bits (16.6 Mbits) |
| Logic Array Blocks (LABs) | 10,200 | — |
| Maximum User I/Os | 976 | — |
| Kemasan | 1517-BBGA, FCBGA | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | 0°C to 85°C | -40C to +100C (Industrial) |
| Core Voltage | 0.9 V | — |
| Process Node | 65 nm | — |
| Aras MSL | [DATA_NEEDED: MSL level] | 3 (per JEDEC J-STD-020) |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Maximum Transceiver Data Rate | 12.5 Gbps | — |
| Maximum User I/O | — | 976 |
| Package Type | — | 1517-BBGA, FCBGA |
| Package Dimensions | — | 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch) |
| Temperature Grade | — | Industrial |
| Speed Grade | — | I4 |
| Lead-Free / RoHS | — | Yes (L suffix) |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |
| Process Technology | — | 65 nm CMOS |
| DSP Blocks (18x18 Multipliers) | — | 768 |
| Configuration Method | — | JTAG, Passive Serial, Fast Passive Parallel |