EP3SE260F1517C4N vs EP3SE260F1517I4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C4N sa pamamagitan ng Intel at EP3SE260F1517I4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517C4N | EP3SE260F1517I4L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Series | Stratix® III E | Stratix III |
| Family | Field-Programmable Gate Array (FPGA) | Stratix III Enhanced (E) |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory | 16,672,768 bits | 16,672,768 bits (16.6 Mbits) |
| Logic Array Blocks (LABs) | 10,200 | — |
| Maximum User I/Os | 976 | — |
| Packhaging | 1517-BBGA, FCBGA | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0°C to 85°C | -40C to +100C (Industrial) |
| Core Voltage | 0.9 V | — |
| Process Node | 65 nm | — |
| Level ng MSL | [DATA_NEEDED: MSL level] | 3 (per JEDEC J-STD-020) |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Maximum Transceiver Data Rate | 12.5 Gbps | — |
| Maximum User I/O | — | 976 |
| Package Type | — | 1517-BBGA, FCBGA |
| Package Dimensions | — | 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch) |
| Temperature Grade | — | Industrial |
| Speed Grade | — | I4 |
| Lead-Free / RoHS | — | Yes (L suffix) |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |
| Process Technology | — | 65 nm CMOS |
| DSP Blocks (18x18 Multipliers) | — | 768 |
| Configuration Method | — | JTAG, Passive Serial, Fast Passive Parallel |