EP3SE260H780C2 vs EP3SE260H780I4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780C2 disebabkan oleh Altera dan EP3SE260H780I4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Altera
EP3SE260H780C2 - Stratix III E 260K LE FPGA | Altera | 780-BGA
EP3SE260H780C2 ⚠ Bahagian terakhir untuk beliIntel
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
EP3SE260H780I4N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260H780C2 | EP3SE260H780I4N |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Family | Stratix® III E | Stratix III Enhanced (Stratix III E) |
| Series | Stratix III | — |
| Logic Elements (LE) | 255,000 | — |
| Adaptive Logic Modules (ALM) | 102,000 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| User I/Os | 488 | 488 |
| Number of LABs/CLBs | 10,200 | — |
| Process Node | 65 nm | — |
| Core Voltage | 0.86 V to 1.15 V | 1.1 V |
| Kemasan | 780-BBGA, FCBGA | 780-pin FC-HFBGA (FCBGA) |
| Jenis Pemasangan | Surface Mount | — |
| Suhu Operasi | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Status RoHS | Compliant | Compliant |
| Lead Free | Yes | — |
| Aras MSL | 3 (per JEDEC J-STD-020) | — |
| Logic Elements | — | 255,000 |
| Embedded Memory Bits | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| Process Technology | — | 65 nm |
| Maximum Operating Frequency | — | 450 MHz |
| Package Dimensions | — | 33 mm x 33 mm |
| Ball Pitch | — | [DATA_NEEDED: BGA ball pitch in mm] |
| Configuration Modes | — | AS, PS, JTAG, FPP |
| Boundary Scan | — | IEEE Std. 1149.1 (JTAG) |
| Lead-Free | — | Yes |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL rating] |