EP3SE260H780C2 vs EP3SE260H780I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C2 sa pamamagitan ng Altera at EP3SE260H780I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP3SE260H780C2 - Stratix III E 260K LE FPGA | Altera | 780-BGA
EP3SE260H780C2 ⚠ Huling PagbiliIntel
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
EP3SE260H780I4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260H780C2 | EP3SE260H780I4N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Family | Stratix® III E | Stratix III Enhanced (Stratix III E) |
| Series | Stratix III | — |
| Logic Elements (LE) | 255,000 | — |
| Adaptive Logic Modules (ALM) | 102,000 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| User I/Os | 488 | 488 |
| Number of LABs/CLBs | 10,200 | — |
| Process Node | 65 nm | — |
| Core Voltage | 0.86 V to 1.15 V | 1.1 V |
| Packhaging | 780-BBGA, FCBGA | 780-pin FC-HFBGA (FCBGA) |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Tindminan RoHS | Compliant | Compliant |
| Lead Free | Yes | — |
| Level ng MSL | 3 (per JEDEC J-STD-020) | — |
| Logic Elements | — | 255,000 |
| Embedded Memory Bits | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| Process Technology | — | 65 nm |
| Maximum Operating Frequency | — | 450 MHz |
| Package Dimensions | — | 33 mm x 33 mm |
| Ball Pitch | — | [DATA_NEEDED: BGA ball pitch in mm] |
| Configuration Modes | — | AS, PS, JTAG, FPP |
| Boundary Scan | — | IEEE Std. 1149.1 (JTAG) |
| Lead-Free | — | Yes |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL rating] |