EP3SE260H780C3 vs EP3SE260H780C4LN Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780C3 disebabkan oleh Intel dan EP3SE260H780C4LN disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260H780C4LN - Stratix III E FPGA 255K LE 780-FCBGA | Intel
EP3SE260H780C4LN ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260H780C3 | EP3SE260H780C4LN |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Device Family | Stratix III Enhanced (Stratix III E) | — |
| Series | EP3SE | — |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10200 | 10,200 |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | 16,672,768 bits (16.67 Mbit) |
| User I/Os | 488 | — |
| Operating Voltage (Core) | 0.9 V | — |
| Operating Voltage (Auxiliary) | 1.1 V | — |
| Process Technology | 65 nm CMOS | — |
| Speed Grade | C3 | C4 (commercial, moderate speed) |
| Suhu Operasi | Commercial, 0C to +85C | 0C to +85C (commercial) |
| Maximum Core Frequency | 500 MHz | — |
| Kemasan | 780-ball FCBGA (HBGA), flip-chip | 780-ball FCBGA (FineLine BGA) |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Tingkat sensitiviti Air Nama (MSL) | 3 (168 hours) | — |
| Packaging Type | Tray | — |
| Configuration Memory Support | Fast passive parallel, JTAG, Active Serial | — |
| Status RoHS | Compliant (per product listings) | Compliant |
| Family | — | Stratix III E |
| Embedded Multipliers (18x18) | — | 384 |
| User I/O Count | — | 488 |
| Core Voltage (VCC) | — | 1.0 V |
| I/O Voltage (VCCIO) | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Auxiliary Voltage (VCCPD/VCCPT) | — | 2.5 V / 3.0 V |
| PLLs | — | 8 |
| Global Clock Networks | — | 16 |
| Process Node | — | 40 nm TSMC |
| Configuration Modes | — | FPP, AS, PS, JTAG |
| Aras MSL | — | 3 (168 hours) |