EP3SE50F484C3G vs EP3C80F484C8 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F484C3G disebabkan oleh Intel dan EP3C80F484C8 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE50F484C3G | EP3C80F484C8 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Stratix III E | Cyclone III |
| Logic Elements | 47,500 | — |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Total Embedded Memory | 5,760,000 bits (5.76 Mbit) | — |
| M9K Memory Blocks | 320 (2,304 Kbits) | — |
| M144K Memory Blocks | 12 (1,728 Kbits) | — |
| User I/O Pins | 296 | — |
| 18x18 Multipliers | 384 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 16 | — |
| Kemasan | 484-ball FCBGA (F484), 1.0 mm pitch | 484-ball FBGA (23x23 mm, 1.0 mm pitch) |
| Speed Grade | C3 | C8 (commercial, slowest Cyclone III grade) |
| Suhu Operasi | 0C to +85C (commercial, "C") | 0C to +85C (commercial) |
| Process Node | 65 nm TSMC low-power | — |
| Core Voltage | 1.1 V | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant (lead-free) | Compliant |
| Logic Elements (LE) | — | 81,264 |
| Total Memory Bits | — | 2,810,880 bits (2810 Kb) |
| Embedded 18x18 Multipliers | — | 244 |
| Maximum User I/O | — | 295 |
| Process Technology | — | 65 nm CMOS |
| Core Voltage (Vccint) | — | 1.2 V |
| Maximum Operating Frequency | — | 402 MHz |
| Lead-Free | — | Yes |
| Memory Interfaces Supported | — | DDR, DDR2, QDRII SDRAM |