EP3SE50F484I4 vs EP3SE50F484I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F484I4 disebabkan oleh Intel dan EP3SE50F484I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE50F484I4 | EP3SE50F484I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Logic Elements (LE) | 47,500 | — |
| Logic Array Blocks (LAB) | 1,900 | — |
| Maximum User I/O | 296 | 296 |
| Embedded Memory (Bits) | 5,760,000 | — |
| DSP Blocks (18x18 Multipliers) | 216 | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 450 MHz | — |
| Kemasan | 484-ball FC-FBGA | 484-pin FC-FBGA (flip-chip BGA) |
| Package Code | BBGA / FC-FBGA | — |
| Temperature / Speed Grade | I4 (Industrial) | — |
| Suhu Hubungan Operasi | -40 C to +100 C | — |
| Status RoHS | Compliant | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements | — | 47,500 |
| Number of LABs | — | 1,900 |
| Total Memory Bits | — | 5,760,000 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Core Voltage VCC | — | 0.9 V |
| Auxiliary Voltage VCCAUX | — | 1.1 V |
| Maximum Internal Frequency | — | 500 MHz |
| Speed Grade | — | I3 (industrial, bin 3) |
| Suhu Operasi | — | -40C to +100C (industrial) |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Configuration Method | — | Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks] |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: number of 18x18 multipliers] |
| Transceiver Count | — | [DATA_NEEDED: number of embedded transceivers] |