EP3SE50F780C4LG vs EP3SE50F780C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F780C4LG disebabkan oleh Intel dan EP3SE50F780C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE50F780C4LG EP3SE50F780C4LG - 47.5K LE Stratix III E FPGA, 488 I/O, FBGA-780 | Intel

EP3SE50F780C4LG - 47.5K LE Stratix III E FPGA, 488 I/O, FBGA-780 | Intel

EP3SE50F780C4LG ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE50F780C4LG EP3SE50F780C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli NRND
Family Stratix III E (Enhanced) Stratix III E
Logic Elements 47,500 LE 47,500
Adaptive Logic Modules (ALMs) 19,000 ALM —
Embedded Memory 5.49 Mbit —
User I/Os 488 I/O —
Number of Logic Array Blocks (LABs) [DATA_NEEDED: LAB count] —
DSP Blocks (18x18 multipliers) [DATA_NEEDED: DSP block count] —
Transceivers [DATA_NEEDED: transceiver count and rate] —
Process Technology 40 nm TSMC low-power CMOS 65 nm
Speed Grade -4 (fastest commercial) C3 (medium)
Operating Temperature (Commercial) 0 C to +85 C —
Core Voltage (VCCINT) 0.9 V / 1.0 V / 1.1 V (programmable) —
Tegangan Pemberi Arus Operasi 1.1 V (logic core nominal) —
Kemasan 780-BBGA, FCBGA (FBGA-780, 1.0 mm pitch) 780-ball FC-FBGA
Jenis Pemasangan Surface Mount (SMT) Surface Mount
Lead-Free Status Pb-free (LG suffix) —
Tingkat sensitiviti Air Nama (MSL) MSL 3 (per JEDEC J-STD-020) —
RoHS Compliance Compliant —
Logic Array Blocks (LABs) — 1,900
Embedded Memory (M9K blocks) — 312
Total Embedded Memory — 5,760 Kbit (5.76 Mbit)
DSP Blocks — 432
Maximum User I/Os — 488
Number of PLLs — 4
Core Voltage — 1.1 V
Temperature Grade — Commercial (0C to +85C)
Status RoHS — Compliant
Lead-Free — Yes

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