EP3SE50F780I3G vs EP3SE50F780I3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F780I3G disebabkan oleh Intel dan EP3SE50F780I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE50F780I3 - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel
EP3SE50F780I3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE50F780I3G | EP3SE50F780I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Family | Stratix III E | Stratix III Enhanced (E) |
| Logic Elements (LE) | 47,500 | — |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory | 8.7 Mbits (M9K + M144K blocks) | — |
| DSP Blocks | 264 (18x18 multipliers) | — |
| Maximum User I/O Pins | 488 | — |
| Transceivers | 12 channels, up to 3.75 Gbps | — |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 40 nm | 65 nm |
| Kemasan | 780-pin FC-FBGA (F780) 29x29 mm | 780-ball FC-FBGA (FineLine BGA) |
| Suhu Operasi | -40C to +100C (Industrial, I3) | — |
| Speed Grade | 3 | — |
| Memory Interfaces | DDR3 up to 800 MHz, DDR2, QDR II+ SRAM | — |
| PCI Express Hard IP | Gen1 x1/x4/x8 | — |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Aras MSL | 3 | 3 (168 hours) |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory (bits) | — | 5,760,000 |
| User I/O Count | — | 488 |
| Internal Frequency (max) | — | 800 MHz |
| Gambaran Suhu Operasi | — | -40 C to +100 C (industrial, 'I' grade) |
| Supply Voltage (Core) | — | 0.86 V to 1.13 V (typical 1.1 V) |
| Configuration Mode | — | Passive Serial / Fast Passive Parallel / JTAG |
| PLLs | — | Up to 8 (fractional-N) |
| DSP Multiplier Blocks | — | Yes (per-ALM DSP blocks) |
| Adaptive Logic Modules (ALMs) | — | Yes |