EP3SE80F780C3N vs EP3SE110F780C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE80F780C3N disebabkan oleh Intel dan EP3SE110F780C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE80F780C3N | EP3SE110F780C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Stratix III | Stratix III E |
| Logic Elements | 80,000 | — |
| Number of LABs | 3200 | — |
| Number of I/Os | 488 | — |
| Package Type | FBGA-780 (FineLine BGA) | — |
| Process Technology | 40 nm CMOS | 65 nm |
| Tegangan Pemberi Arus | 0.9 V core | — |
| Suhu Operasi | 0 °C to 85 °C (commercial) | — |
| Internal Frequency (max) | 717 MHz | — |
| Speed Grade | C3 | — |
| Lead-Free | Yes (Pb-free) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Memory Subsystem | TriMatrix embedded memory | — |
| DSP Blocks | Yes, dedicated DSP blocks | Yes (integrated, count varies by configuration) |
| Status RoHS | Compliant | Compliant |
| Total Pins | 780 | — |
| Logic Elements (LEs) | — | 107,500 |
| Embedded Memory Bits | — | 8,936,448 |
| Logic Array Blocks (LABs) | — | 4,300 |
| User I/Os | — | 488 |
| Kemasan | — | 780-ball FCBGA (Flip-Chip BGA) |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 500 MHz |
| Transceiver Channels | — | 8 (multi-gigabit) |
| Embedded Memory | — | TriMatrix (MLAB + M9K + M144K) |
| Configuration Method | — | Serial / Parallel via Quartus II |
| Operating Temperature Grade | — | Commercial (C suffix) |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |