EP3SL200H780I3 vs EP3SL200H780I3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL200H780I3 disebabkan oleh Intel dan EP3SL200H780I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SL200H780I3 EP3SL200H780I3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Series Stratix III L —
Family Stratix III Stratix III L
Logic Elements 200,000 200,000
LABs (Logic Array Blocks) 8000 —
Total RAM Bits 10,901,504 (10,900 Kb) —
User I/O Count 488 —
Number of I/O Banks [DATA_NEEDED: I/O banks] —
Embedded Multipliers (DSP blocks) 384 (18x18) —
PLLs 12 —
Process Technology 65 nm CMOS —
Core Voltage 1.1 V —
Maximum Operating Frequency 717 MHz —
Suhu Operasi -40C to +100C (Industrial) -40C to +100C (Industrial)
Kemasan 780-BBGA, FCBGA (HBGA-780) 780-BBGA, FCBGA
Jenis Pemasangan Surface Mount Surface Mount
Supplier Device Package 780-FBGA (29x29 mm) —
Lead-Free / RoHS Compliant (lead-free) —
RAM Bits — 10,901,504
User I/O — 488
Package Pin Count — 780
Supply Voltage (Core) — 0.9 V
Technology — CMOS, 40 nm
Process Node — 40 nm
Number of Terminals — 780
Case / Package Code — BGA-780
Status RoHS — Compliant
Lead-Free — Yes

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