EP3SL50F780C3 vs EP3SL50F780C2G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL50F780C3 disebabkan oleh Intel dan EP3SL50F780C2G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera
EP3SL50F780C3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SL50F780C3 | EP3SL50F780C2G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | NRND |
| Family | Stratix III L (low-power) | — |
| Series | Stratix III | Stratix III L |
| Logic Elements | 47,500 | 47,500 LE |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory Bits | 2,184,192 | — |
| User I/Os | 488 | 488 |
| Package Type | 780-BBGA, FCBGA (FineLine) | — |
| Device Pin Count | 780 | — |
| Suhu Operasi | 0C to +85C (Commercial) | 0 °C to +85 °C (Commercial) |
| Speed Grade | 3 | -2 (C2) |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT nominal value] | — |
| PLLs | 12 | — |
| Global Clock Networks | 24 | — |
| Process Node | 65 nm TSMC | — |
| Configuration Method | SRAM-based, supports Partial Reconfiguration | — |
| Status RoHS | Compliant | Pb-Free / RoHS Compliant (-G suffix) |
| Lead-Free / Halogen-Free | Lead-Free (per package marking); Halogen-Free status unknown | — |
| Tingkat sensitiviti Air Nama (MSL) | MSL3 (per JEDEC J-STD-020, typical for large FBGA) | — |
| Adaptive Logic Modules (ALMs) | — | 19,000 ALM |
| Embedded Memory | — | 2.08 Mbit |
| Total Memory Bits | — | 2,184,192 bit |
| Operating Supply Voltage (Core) | — | 1.1 V |
| Kemasan | — | 780-ball FCBGA |
| Jenis Pemasangan | — | Surface Mount |
| Transceivers | — | Reduced / Not Featured (L-tier) |
| DSP Blocks | — | 18×18 multipliers (per family datasheet) |
| Configuration | — | JTAG / Passive Serial / Fast Passive Parallel |