EP3SL50F780C3G vs EP3SL50F780C2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL50F780C3G disebabkan oleh Intel dan EP3SL50F780C2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SL50F780C3G - Stratix III L FPGA, 47.5K LE, 488 I/O, 780-FBGA | Altera / Intel
EP3SL50F780C3G ✓ AktifPengandingan Spesifikasi
| Parametr | EP3SL50F780C3G | EP3SL50F780C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Stratix III L | Stratix III L |
| Logic Elements (LE) | 47,500 | 47,500 |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory (bits) | 2,184,192 | 2,184,192 |
| Distributed RAM | 2.08 Mbit | — |
| User I/O Count | 488 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Suhu Operasi | 0C to +85C (commercial) | 0°C to +85°C (commercial) |
| Temperature Grade Suffix | C (commercial, "3" speed grade) | — |
| Kemasan | 780-ball FBGA | 780-ball FCBGA (Flip-Chip BGA) |
| Jenis Pemasangan | SMD/SMT | Surface Mount (BGA) |
| Packaging | Tray | — |
| Process Technology | TSMC 40 nm low-power | 65 nm |
| Configuration Method | SRAM-based, JTAG/AS configuration | — |
| Design Software | Intel Quartus II (v9.0+) | — |
| Status RoHS | Compliant (per DigiKey listing) | Compliant |
| Logic Array Blocks (LABs) | — | 1,900 |
| Maximum User I/Os | — | 488 |
| Maximum Core Frequency | — | 600 MHz |
| Configuration Interface | — | JTAG / passive serial / fast passive parallel |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces |
| Embedded Memory Type | — | TriMatrix (MLAB, M9K, M144K blocks) |