EP3SL50F780I4 vs EP3SL50F780I3 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL50F780I4 disebabkan oleh Intel dan EP3SL50F780I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SL50F780I4 EP3SL50F780I4 - 50K LE Stratix III L FPGA, 780-BGA, Industrial | Intel

EP3SL50F780I4 - 50K LE Stratix III L FPGA, 780-BGA, Industrial | Intel

EP3SL50F780I4 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SL50F780I4 EP3SL50F780I3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli NRND
Series Stratix III L Stratix III L
Manufacturer Intel (formerly Altera) —
Process Node 40 nm TSMC —
Logic Elements 47,500 47,500
Embedded Memory Bits 2,184,192 —
Embedded Memory Blocks M20K blocks —
DSP 18x18 Multipliers 244 —
User I/Os 488 —
PLLs 8 —
Global Clock Networks 28 —
Core Voltage 0.9 V Selectable 1.1 V / 0.9 V
Suhu Operasi -40C to +100C (Industrial) -40C to +100C (industrial)
Kemasan 780-BBGA, FCBGA 780-ball FC-FBGA (FineLine BGA), 1 mm pitch
Jenis Pemasangan Surface Mount Surface Mount
Speed Grade I4 (fastest) I3 (industrial, third-fastest bin)
Configuration Method Serial, parallel, or JTAG —
Memory Interfaces DDR3, QDRII+, RLDRAM II —
Hard IP PCIe Gen2 hard IP blocks —
Status RoHS Compliant Compliant
Logic Array Blocks (LABs) — 1,900
User I/O Pins — 488
Total Memory Bits — 2,106 Kbit (M9K + M144K)
Transceiver Channels — 16 (up to 3.75 Gbps) + 8 (up to 6.5 Gbps)
Process Technology — 65 nm
Lead Free — Yes
Vertical Migration — Drop-in to EP3SL70 in 780-FBGA package

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