EP3SL50F780I4 vs EP3SL50F780I3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F780I4 sa pamamagitan ng Intel at EP3SL50F780I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL50F780I4 EP3SL50F780I3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili NRND
Series Stratix III L Stratix III L
Manufacturer Intel (formerly Altera) —
Process Node 40 nm TSMC —
Logic Elements 47,500 47,500
Embedded Memory Bits 2,184,192 —
Embedded Memory Blocks M20K blocks —
DSP 18x18 Multipliers 244 —
User I/Os 488 —
PLLs 8 —
Global Clock Networks 28 —
Core Voltage 0.9 V Selectable 1.1 V / 0.9 V
Temperature na Operasyon -40C to +100C (Industrial) -40C to +100C (industrial)
Packhaging 780-BBGA, FCBGA 780-ball FC-FBGA (FineLine BGA), 1 mm pitch
Uri ng Pagpapasok Surface Mount Surface Mount
Speed Grade I4 (fastest) I3 (industrial, third-fastest bin)
Configuration Method Serial, parallel, or JTAG —
Memory Interfaces DDR3, QDRII+, RLDRAM II —
Hard IP PCIe Gen2 hard IP blocks —
Tindminan RoHS Compliant Compliant
Logic Array Blocks (LABs) — 1,900
User I/O Pins — 488
Total Memory Bits — 2,106 Kbit (M9K + M144K)
Transceiver Channels — 16 (up to 3.75 Gbps) + 8 (up to 6.5 Gbps)
Process Technology — 65 nm
Lead Free — Yes
Vertical Migration — Drop-in to EP3SL70 in 780-FBGA package

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