EP3SL70F780C4L vs EP3SL70F780C4G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F780C4L disebabkan oleh Intel dan EP3SL70F780C4G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SL70F780C4G - 67.5K LE Stratix III L FPGA, 488 I/O, FCBGA-780 | Intel
EP3SL70F780C4G ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SL70F780C4L | EP3SL70F780C4G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III L | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements (LE) | 67,500 | 67,500 |
| Total Memory Bits | 2,699,264 bits (~2.7 Mb) | — |
| Logic Array Blocks (LABs) | 2,700 | — |
| Maximum User I/O | 488 | 488 |
| Process Technology | 65 nm | — |
| Internal Frequency (max) | [DATA_NEEDED: internal frequency] | — |
| Core Voltage (VCC) | 0.9 V | — |
| Speed Grade | C4 | C4 (commercial) |
| Suhu Operasi | 0C to 85C (commercial) | — |
| Package Type | 780-BBGA, FC-FBGA (Flip-Chip) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (SMD/SMT) |
| Lead Free / RoHS | Yes (lead-free per BGA package) | — |
| Configuration Method | JTAG, Passive Serial, FPP, external memory | — |
| Design Software | Quartus II (Stratix III device support) | — |
| Family | — | Stratix III L |
| Adaptive Logic Modules (ALM) | — | 27,000 |
| Embedded Memory | — | 2,699,264 bits (2.57 Mbit) |
| Kemasan | — | 780-ball FCBGA (Flip-Chip BGA) |
| Operating Supply Voltage (Core) | — | 1.1 V |
| Gambaran Suhu Operasi | — | 0C to +85C (Commercial) |
| Process Node | — | 40 nm TSMC low-power |
| Number of PLLs | — | 8 |
| DSP Multipliers (18x18) | — | [DATA_NEEDED: DSP block count] |
| Configuration Modes | — | PS, FPP, AS, JTAG |
| Status RoHS | — | Compliant |
| Aras MSL | — | 3 |