EP3SL70F780C4LN vs EP3SL70F780C4G Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F780C4LN disebabkan oleh Intel dan EP3SL70F780C4G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SL70F780C4G EP3SL70F780C4G - 67.5K LE Stratix III L FPGA, 488 I/O, FCBGA-780 | Intel

EP3SL70F780C4G - 67.5K LE Stratix III L FPGA, 488 I/O, FCBGA-780 | Intel

EP3SL70F780C4G ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SL70F780C4LN EP3SL70F780C4G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Masa Terakhir Dibeli
Family Stratix III L Stratix III L
Logic Elements 67,500 —
Logic Array Blocks (LABs) 2,700 —
Total RAM Bits 2,699,264 —
User I/O Pins 488 —
Bilangan Pin 780 —
Package Type 780-FBGA (FCBGA) —
Package Dimensions 29 x 29 mm —
Process Technology 65 nm —
Core Voltage Range 0.86 V to 1.15 V —
Suhu Hubungan Operasi 0C to 85C (commercial) —
Jenis Pemasangan Surface Mount Surface Mount (SMD/SMT)
Status RoHS Compliant Compliant
Aras MSL 3 (per JEDEC J-STD-020) 3
Design Software Quartus II (legacy Stratix III support) —
Logic Elements (LE) — 67,500
Adaptive Logic Modules (ALM) — 27,000
Embedded Memory — 2,699,264 bits (2.57 Mbit)
Maximum User I/O — 488
Kemasan — 780-ball FCBGA (Flip-Chip BGA)
Operating Supply Voltage (Core) — 1.1 V
Speed Grade — C4 (commercial)
Gambaran Suhu Operasi — 0C to +85C (Commercial)
Process Node — 40 nm TSMC low-power
Number of PLLs — 8
DSP Multipliers (18x18) — [DATA_NEEDED: DSP block count]
Configuration Modes — PS, FPP, AS, JTAG

Laporan Datasheet & Sumber

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