EP3SL70F780I4L vs EP3SL70F780I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F780I4L disebabkan oleh Intel dan EP3SL70F780I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL70F780I4L | EP3SL70F780I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| Embedded Memory Bits | 2,699,264 | — |
| User I/O Pins | 488 | — |
| Kemasan | 780-ball FBGA (FineLine BGA) | — |
| Suhu Operasi | -40C to +100C (industrial) | — |
| Speed Grade | I4 | I3 (industrial) |
| Power Variant | L (low static power) | — |
| Process Node | 40 nm | — |
| Configuration Method | Serial / Parallel / JTAG via Quartus II | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceivers | None (logic/transceiver-less L variant) | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant (per distributor listings) |
| Embedded Memory (bits) | — | 2,699,264 |
| User I/Os | — | 488 |
| Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 1.1 V (1.05 V to 1.15 V) |
| Operating Frequency | — | 500 MHz |
| Package Type | — | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) |
| Ball Pitch | — | 1.0 mm |
| Suhu Hubungan Operasi | — | -40 C to +100 C |
| Configuration | — | SRAM-based, volatile |